Title:
温度計測システム、基板処理装置及び温度計測方法
Document Type and Number:
Japanese Patent JP5805498
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a temperature measurement system capable of suitably measuring a temperature making good use of light interference, a substrate processing apparatus, and a temperature measurement method.SOLUTION: A temperature measurement system 1 includes a light source 10, a spectroscope 14, light transmission mechanisms 11, 12, a light path length calculation part 16, and a temperature calculation part 20. The light source 10 emits measurement light. The light transmission mechanisms 11, 12 emit reflected light from a top surface 13a and a reverse surface 13b of an object 13 of measurement to the spectroscope 14. The spectroscope 14 measures an interference intensity distribution as an intensity distribution of the reflected light. The light path length calculation part 16 calculates a light path length through Fourier transformation.The temperature calculation part 20 calculates the temperature of the object 13 of measurement on the basis of the relation between the light path length and temperature. The light source 10 has a light source spectrum of half-value half width Δλ satisfying a condition based on a wavelength span Δw of the spectroscope 14. The spectroscope 14 measures the intensity distribution with a sampling number Nsatisfying a condition based upon the wavelength span Δw and a measurement maximum thickness (d).
Inventors:
Tatsuo Matsudo
Kenji Nagai
Kenji Nagai
Application Number:
JP2011239002A
Publication Date:
November 04, 2015
Filing Date:
October 31, 2011
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
G01K11/12; G01B9/02; G01B11/06; G01K5/52; H01L21/3065
Foreign References:
| US20050046862 | ||||
| US20090219542 | ||||
| US5208643 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Omori Tetsuhei
Yoshiki Kuroki
Junji Kashiwaoka
Omori Tetsuhei