Title:
移動可能なセンサ部品を有する温度検出装置
Document Type and Number:
Japanese Patent JP7262771
Kind Code:
B2
Abstract:
To provide a temperature detection device capable of mounting a predetermined number of sensor components movably along a pair of long electric wires.SOLUTION: Each sensor component 2 is made of an annular body 8 of a shape memory alloy or a shape memory resin disposed between a pair of fixing tools 10, 10, the inner diameter of the annular body is equal to or more than the total diameter of the pair of electric wires 3, the sensor component 2 can be moved and is made still by the fixing tools 10, 10 according to a state of a wiring place of the pair of electric wires 3, the annular body 8 of the sensor component 2 is restored to a clamping shape by temperature when the temperature is increased to a high temperature in a specific installation position, and an ambient temperature of the installation position can be detected by contact or connection of both conductors 5, 5 of the pair of electric wires 3 and hence by conduction of current.SELECTED DRAWING: Figure 1
Inventors:
Koichi Wada
Application Number:
JP2019205154A
Publication Date:
April 24, 2023
Filing Date:
November 13, 2019
Export Citation:
Assignee:
Koichi Wada
International Classes:
G01K5/52; G01K5/56; G01K11/12; G08B17/06
Domestic Patent References:
| JP61267198A | ||||
| JP6090640U | ||||
| JP201710653A | ||||
| JP2183973A | ||||
| JP1141760A |
Foreign References:
| WO2005010841A1 |
Attorney, Agent or Firm:
Akio Kanzaki