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Title:
TEMPERATURE SENSOR DEVICE AND SENSOR SYSTEM
Document Type and Number:
Japanese Patent JP2020112355
Kind Code:
A
Abstract:
To provide a temperature sensor device and a sensor system which have good thermal conductivity and responsiveness and are easy to manufacture.SOLUTION: Provided are: a heat sensitive element 2; a magnet portion 3 having a contact surface 3a with a measurement object S on a lower surface and having a female screw hole 3b penetrating vertically; and a male screw member 4 screwed into the female screw hole. The male screw member is a hollow screw having a hollow portion 4a inside. The heat sensitive element is arranged in the hollow portion. At least the periphery of the heat sensitive element from the lower end of the hollow portion is filled with insulative hollow portion filler 10.SELECTED DRAWING: Figure 1

Inventors:
KISHI YASUNARI
GO YOSHIOMI
KAMIJO HIROKI
Application Number:
JP2019000947A
Publication Date:
July 27, 2020
Filing Date:
January 08, 2019
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP
International Classes:
G01K1/14; G01H17/00; G01K1/18; G08C15/00
Domestic Patent References:
JP2012058262A2012-03-22
JP3164702U2010-12-09
JP2017198713A2017-11-02
JP2001235362A2001-08-31
JPH10227700A1998-08-25
Attorney, Agent or Firm:
Hideyuki Sugiura