TEMPERATURE SENSOR, SEMICONDUCTOR WAFER WITH TEMPERATURE MEASURING FUNCTION, AND METHOD OF FORMING THERMOCOUPLE SENSOR

Title:

TEMPERATURE SENSOR, SEMICONDUCTOR WAFER WITH TEMPERATURE MEASURING FUNCTION, AND METHOD OF FORMING THERMOCOUPLE SENSOR

Document Type and Number:

Japanese Patent JPH11118616

Kind Code:

A

Abstract:

To enable measuring the surface temperature of a wafer in a semiconductor manufacturing equipment, improve precision, and reduce cost.

This temperature sensor contains a semiconductor wafer 26 having a thermocouple contact 46 formed or arranged on the wafer surface 30. The thermocouple contact 46 can contain a first patterned conductor 36 and a second patterned conductor 40 formed separately from the conductor 36. The first and the second patterned conductors 36 and 40 are in electric contact with each other and form the thermocouple contact 46 in an overlap region. Other thermocouple contacts are formed above the thermocouple contact 46, and a plurality of thermoelectric couples laminated in the vertical direction are formed. Thereby the temperature gradient in the vertical direction can be measured.

Inventors:

WILLIAM H SCHWAGERMAN
WILLIAM C SHEW
DAVID P CALVERTSON

Application Number:

JP26016497A

Publication Date:

April 30, 1999

Filing Date:

September 25, 1997

Export Citation:

Click for automatic bibliography generation Help

Assignee:

CLAUDE S GORDON CO

International Classes:

G01K7/02; H01L21/822; H01L27/04; H01L35/00; (IPC1-7): G01K7/02; H01L27/04; H01L21/822; H01L35/00

Attorney, Agent or Firm:

Shusaku Yamamoto

Previous Patent: TEMPERATURE SENSOR FOR OBJECT TO BE MEASURED HAVING STRETCHABILITY

Next Patent: TEMPERATURE CONTROLLER