To absorb stress generated due to a difference in thermal expansion coefficient, upon exposure to a thermal shock, for the improvement of the thermal shock resistance of a heat sensitive element by applying a structure for enveloping the vicinity of the element with soft resin.
A heat sensitive element 11 is connected to external terminal boards 14a and 14b via signal takeout leads 12a and 12b having insulation tubes 13a and 3b, and inserted in an insulation seal cap 15. Also, the insulation seal cap 15 is filled with soft resin 18 and this resin 18 is solidified, thereby fixing the heat sensitive element 11. Furthermore, the insulation seal cap 15 is laid in a metallic case 16 having an opening at one end and buried therein by use of molding resin 17. Also, the external terminal boards 14a and 14b are integrated with each other by use of the molding resin 17. Thus, stress appearing due to a difference in thermal expansion coefficient, upon exposure to a thermal shock, is absorbed and alleviated via the deformation of the soft resin 18.
SENBA MASASHI
SASAKI HIDEFUMI
HABATA ETSURO
