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Patent Searching and Data


Title:
TEMPORARILY PROVIDED MODULE AND MODULE ASSEMBLY METHOD, AND CONNECTION METAL PART
Document Type and Number:
Japanese Patent JP2000345621
Kind Code:
A
Abstract:

To provide a temporarily provided module, a module assembly method and a connection metal part in which the temporarily provided module is formed using a highly versatile material, the recyclability is improved, and the temporarily provided module can be easily constructed without using a fixing means such as welding.

In this temporarily provided module and the module assembly method, a renctangular clamp part is provided, one side to form this clamp part is rotatable, a pipe clamp capable of holding a pipe is pivotably attached to a side surface of the one side, and a connection metal part 36 to give two degrees of freedom to the pipe clamp is used for the clamp part. An external frame 18 to constitute a building module 10 is held by the clamp part, and a scaffolding pipe 24 held by the pipe clamp is suspended by the rotation of the one side and the pipe clamp. A reinforcement pipe 28 is assembled to the scaffolding pipe 24 through a pair of pipe clamps, and the building module 10 is held by the reinforcement pipe 28.


Inventors:
YOSHIZAKI MASATOSHI
EHATA SHINICHI
YASUDA SHIGEMI
KAMOSHITA YASUJI
Application Number:
JP15587599A
Publication Date:
December 12, 2000
Filing Date:
June 03, 1999
Export Citation:
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Assignee:
HITACHI PLANT ENG & CONSTR CO
International Classes:
E04B1/348; E04G21/14; E04H5/02; (IPC1-7): E04B1/348; E04G21/14; E04H5/02