Title:
TEMPORARY FIXING LAMINATE, TEMPORARY FIXING LAMINATE FILM, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2023177095
Kind Code:
A
Abstract:
To provide a temporary fixing laminate film and a temporary fixing laminate that can be suitably used in a method for manufacturing a semiconductor device that includes a step of processing a semiconductor member temporarily fixed to a support member, and can separate a processed semiconductor component from the support component with lower light irradiation energy.SOLUTION: A temporary fixing laminate 20 is used for temporarily fixing a semiconductor member and a support member. The temporary fixing laminate 20 includes a support member 22, and a temporary fixing material layer 10A provided on the support member 22, and the temporary fixing material layer 10A includes a first curable resin layer 14, a metal layer 12, and a second curable resin layer 16 in this order starting from the support member 22. The thickness of the metal layer 12 is 1 μm or more. The thickness of the second curable resin layer 16 is 2 to 10 times the thickness of the first curable resin layer 14.SELECTED DRAWING: Figure 2
Inventors:
INOUE YUKIKO
ENOMOTO TETSUYA
AKASU YUTA
MIYAZAWA EMI
ENOMOTO TETSUYA
AKASU YUTA
MIYAZAWA EMI
Application Number:
JP2022089808A
Publication Date:
December 13, 2023
Filing Date:
June 01, 2022
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
H01L21/02; B32B7/06; B32B15/08; C09J5/00; C09J7/30; C09J201/00; H01L21/301; H01L21/304; H01L21/56; H01L21/683
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano
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