Title:
TEMPORARY PASSIVATION LAYER ON SUBSTRATE
Document Type and Number:
Japanese Patent JP2022173604
Kind Code:
A
Abstract:
To selectively remove passivation layers without the need to use additional processing steps, such as aggressive chemical etching or mechanical polishing.SOLUTION: A substrate includes a metal component on a surface. A polymeric layer is deposited on the surface using molecular layer deposition. The polymeric layer includes a metalcone and has a thickness from 1 nm to 20 nm. The polymeric layer is stable at room temperature, but undergoes a structural change at high temperature. The polymeric layer can be annealed to cause a structural change, which can occur during soldering.SELECTED DRAWING: Figure 3
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Inventors:
MICHAEL GRIMES
LIN YUYUAN
LIN YUYUAN
Application Number:
JP2022062618A
Publication Date:
November 21, 2022
Filing Date:
April 04, 2022
Export Citation:
Assignee:
SPTS TECHNOLOGIES LTD
International Classes:
H01L21/312; C23C16/455; C23C16/56; C23C24/08
Attorney, Agent or Firm:
Patent Attorney Corporation YKI International Patent Office