Title:
TENSION PAD FOR TEST OF STRUCTURAL STRENGTH
Document Type and Number:
Japanese Patent JPH06288859
Kind Code:
A
Abstract:
PURPOSE: To provide a tension pad which can charge a predetermined load with no peeling of an adhesive even under a high-temperature/high-humidity environment.
CONSTITUTION: The following are provided: a sample 5 that is a structure; a back skin 1 used for charging the sample 5 with a load; a groove provided in one face of the back skin 1; a low elastic body 4 arranged between the sample 5 and the back skin 1 and adhered to the sample 5 in one face and to the grooved la face of the back skin 1 in the other face; a metal 2 applied to bolt fastening with the back skin 1 provided inside the low elastic body 4; and a sealant 6 so provided as to cover an adhesive 7 used for the above- mentioned adhesion.
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Inventors:
SAKA MASAHARU
Application Number:
JP7826393A
Publication Date:
October 18, 1994
Filing Date:
April 05, 1993
Export Citation:
Assignee:
MITSUBISHI HEAVY IND LTD
International Classes:
G01M5/00; (IPC1-7): G01M5/00
Attorney, Agent or Firm:
Takehiko Suzue