Title:
端子圧着装置
Document Type and Number:
Japanese Patent JP7221916
Kind Code:
B2
Abstract:
A terminal crimping device includes a lower mold and an upper mold. The lower mold has a lower contact face onto which a crimping and forming part is to be mounted, and a lower mold recessed part that is recessed in an opposite direction to a crimping direction and a lower mold projecting part that projects in the crimping direction, respectively from both end parts of the lower contact face in width directions when viewed in front-rear directions. The upper mold has an upper contact face, an upper mold recessed part and an upper mold projecting part.
Inventors:
Hirotatsu Shibayama
Shoya Ueda
Shoya Ueda
Application Number:
JP2020148189A
Publication Date:
February 14, 2023
Filing Date:
September 03, 2020
Export Citation:
Assignee:
Yazaki Corporation
International Classes:
H01R43/048
Domestic Patent References:
| JP34000133B1 | ||||
| JP2016110770A | ||||
| JP2011171057A | ||||
| JP2020027726A | ||||
| JP5034693U | ||||
| JP60013691U |
Foreign References:
| US4370881 | ||||
| US4027519 | ||||
| US3905220 | ||||
| US9166353 |
Attorney, Agent or Firm:
Toranomon Intellectual Property Office