Title:
熱伝導性複合シリコーンゴムシート
Document Type and Number:
Japanese Patent JP7149229
Kind Code:
B2
Abstract:
The present invention is a thermal conductive composite silicone rubber sheet including a thermal conductive silicone rubber sheet and a thermosoftening silicone resin layer provided with a thickness of 0.5 to 10 µm on at least one side of the thermal conductive silicone rubber sheet, the thermosoftening silicone resin layer having an absolute viscosity at 70°C of 700 Pa·s or lower, where the thermosoftening silicone resin layer has adhesion of 0.5 N/25 mm or higher at a normal temperature and the thermal conductive composite silicone rubber sheet has a thermal resistance that is lower than a value obtained by adding 0.3 cm2·K/W per one layer of one side of the thermosoftening silicone resin layer to a thermal resistance of the thermal conductive silicone rubber sheet. This provides a thermal conductive composite silicone rubber sheet provided with an adhesive layer on at least one side of a thermal conductive silicone rubber sheet, that makes it possible to impart adhesion without sacrificing thermal conductivity as much as possible.
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Inventors:
Ishihara Yasuhisa
Akihiro Endo
Akihiro Endo
Application Number:
JP2019113297A
Publication Date:
October 06, 2022
Filing Date:
June 19, 2019
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
B32B25/20; B32B7/022; B32B7/027; C09J7/25; C09J7/38; C09J183/04
Domestic Patent References:
JP2008509025A | ||||
JP2004311577A | ||||
JP2013086433A |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi
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