PURPOSE: To reduce a heat capacity, and improve performance of a thermal detector by contracting a physical area of a detector pixel in a focal surface array.
CONSTITUTION: A thermal detection system 10 is composed including a focal surface array 12, a heat insulation structure body 14, and an integrated circuit board 16. The focal surface array 12 includes heat sensors 28, and each heat sensor comprises a related heat detection element. The heat detection element is coupled with an infrared absorption body and a common electrode assembly 36 at one surface, and it is coupled with a related contact pad disposed on an integrated circuit board 16 at the other surface. Net-like cut grooves 52a, 52b are provided to put thermal detection elements 30a, 30b, 30c adjacent to each other to be part from each other for a distance of about half an average width of at least one thermal detection element 30a, 30b, 30c. Non-net-like optical coating 38 is continuously disposed on the thermal detection elements 30a, 30b, 30c to set absorption of heat radiation incidental to the focal surface array 12 to be the maximum.
JIEEMUZU EFU BERUCHIYAA
HAWAADO AARU BERATAN
SUCHIIBUN ENU FURANKU
CHIYAARUZU EMU HANSON
POORU OO JIYONSON
ROBAATO JIEI ESU KAIRU
EDOWAADO JII MEISUNAA
ROBAATO EI OOUEN
GEIRU DEII SHIERUTON
UIRIAMU KEI UOOKAA
