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Title:
THERMAL INSULATION MATERIAL
Document Type and Number:
Japanese Patent JP2011073959
Kind Code:
A
Abstract:

To provide a thermal insulation material exerting high thermal insulation performance exhibited by inorganic nanoparticles and excellent in handleability, workability and construction property.

The thermal insulation material includes a first molded article formed by compression-molding inorganic nanoparticles, a second molded article laminated on at least one side of the first molded article and having a bending strength of ≥0.4 MPa, and an accouplement coupling the first and second molded articles.


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Inventors:
GOTO YOSHIHIKO
ITO YASUO
MAEDA TAKESHI
SAKAMOTO AKISHI
Application Number:
JP2010187403A
Publication Date:
April 14, 2011
Filing Date:
August 24, 2010
Export Citation:
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Assignee:
NICHIAS CORP
International Classes:
C04B38/00; B28B11/00; B28B23/00; B32B7/08
Domestic Patent References:
JP2008194974A2008-08-28
JPS61166827U1986-10-16
JP2005036975A2005-02-10
JPH08121683A1996-05-17
JP2009041649A2009-02-26
JP2008194974A2008-08-28
JPS61166827U1986-10-16
Attorney, Agent or Firm:
Shohei Oguri
Hironori Honda
Toshimitsu Ichikawa



 
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