熱インターフェース接着剤及び再加工 - INTERNATIONAL BUSINESS MASCHINES CORPORATION

Title:

熱インターフェース接着剤及び再加工

Document Type and Number:

Japanese Patent JP4428659

Kind Code:

B2

Abstract:

A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

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Inventors:

Krishna G. Sachidev
Daniel G. Burger
Kelly May Show Jones
Glenn Gie Dave
Hilton Tea Toy

Application Number:

JP2005119145A

Publication Date:

March 10, 2010

Filing Date:

April 18, 2005

Export Citation:

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Assignee:

INTERNATIONAL BUSINESS MASCHINES CORPORATION

International Classes:

C09D9/00; C09J163/00; C08K3/08; C09J9/00; C09J9/02; C09J11/04; C09J11/06; C09J11/08; C09J183/06; H01B1/00; H01B1/22; H01B1/24; H01L23/373; H01L23/42; H01L23/433; H05K3/32

Domestic Patent References:

JP10064929A
JP10101962A
JP11339559A
JP2000215729A
JP2004047174A

Foreign References:

WO2004003066A1
US20020127406

Attorney, Agent or Firm:

Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Hiroshi Sakaguchi

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