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Title:
THERMAL PRINT HEAD
Document Type and Number:
Japanese Patent JP2013071353
Kind Code:
A
Abstract:

To improve the soundness of bonding of a driving IC.

A thermal print head includes: a heating element plate 20 having a heating resistor and electrodes 28 extending from it on the surface of a glaze layer 25 fixed on the surface of the ceramic substrate 22; a flexible substrate 40; the driving IC 42; bonding wires 44; and a sealing resin 48. The flexible substrate 40 has a base film 51, copper foil 52 attached to the surface of the base film 51, a coverlay 56 which covers a part of the copper foil 52, and an adhesive agent 54 which bonds the coverlay 56. The driving IC 42 has an insulating packaging and several IC terminals which are exposed to the packaging other than its bottom face and its bottom is bonded to the copper foil 52. The bonding wires 44 bridge the IC terminals of the driving IC 42 and the electrodes 28. The sealing resin 48 seals the driving IC 42 and the bonding wires 44.


Inventors:
SUZUKI TOMONORI
Application Number:
JP2011212819A
Publication Date:
April 22, 2013
Filing Date:
September 28, 2011
Export Citation:
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Assignee:
TOSHIBA HOKUTO ELECT CORP
International Classes:
B41J2/345; B41J2/335
Domestic Patent References:
JPH03206630A1991-09-10
JPH0550633A1993-03-02
JPH06286187A1994-10-11
JPH03209748A1991-09-12
JPH10200217A1998-07-31
JPH01196132A1989-08-07
JPH0839857A1996-02-13
JPS63179764A1988-07-23
JP2006334791A2006-12-14
JP2011068069A2011-04-07
JP2002166583A2002-06-11
Attorney, Agent or Firm:
Norio Ohu
Ken Toyonaga