Title:
THERMAL STENCIL PRINTING MASTER
Document Type and Number:
Japanese Patent JP3824109
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a thermal stencil printing master having small back face contamination of a printed matter without printing unevenness with small ink adhering amount in the master having a support with strong stiffness to improve perforating sensitivity by preventing contraction of the master at the time of forming a thermal stencil.
SOLUTION: The thermal stencil printing master comprises (preferably a porous resin film and) porous fiber film 21 adhered to one surface of a thermoplastic resin film 20 so that the film 21 is released at least at a part corresponding to an image the surface of the film (preferably porous resin film) before winding it on a drum and wound on the drum in this state, and an ink layer interposed between the film 20 (preferably porous resin film) and the porous fiber film 21 at the time of printing.
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Inventors:
Tomiya Mori
Application Number:
JP15602197A
Publication Date:
September 20, 2006
Filing Date:
May 29, 1997
Export Citation:
Assignee:
Tohoku Ricoh Co., Ltd.
International Classes:
B41N1/24; (IPC1-7): B41N1/24
Domestic Patent References:
| JP7068964A | ||||
| JP7314936A |
Attorney, Agent or Firm:
Koichi Hirota