Title:
熱応力緩和パッド及びそれを用いた熱電変換システム並びにペルチェ冷却システム
Document Type and Number:
Japanese Patent JP3552567
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To eliminate the necessity of adjusting a junction or pressing force and guarantee a good conduction of heat and reduce thermal stress by filling a porous matrix with fibers made of such material as to have a high thermal conductivity. SOLUTION: A thermal stress reducing pad 1 can be made just by filling a matrix 2 with fibers 3 oriented in the thickness direction of the pad, that is, the direction in which heat needs to be transmitted, and then hardening the matrix 2. In other words, the thermal stress reducing pad 1 can be manufactured not only easily but also at low cost. Moreover, this pad 1 needs not to be joined either to a thermoelectric transducing unit 4, a heating duct 7, or a cooling duct 8 and therefore the entire power generation system can be assembled easily and replacement of the thermoelectric unit 4 can be facilitated. And, the pad 1 can be provided with a good thermal conductivity characteristic since the porous matrix is filled with the fibers made of such material as to have a high thermal conductivity.
Inventors:
Kobe Manpukuji
Ryo Kawasaki
Ryo Kawasaki
Application Number:
JP1170999A
Publication Date:
August 11, 2004
Filing Date:
January 20, 1999
Export Citation:
Assignee:
CENTRAL RESEARCH INSTITUTE OF ELECTRIC POWER INDUSTRY
International Classes:
H01L35/06; F25B21/02; H01L35/28; H01L35/30; H01L35/34; (IPC1-7): H01L35/28; F25B21/02; H01L35/06; H01L35/30; H01L35/34
Domestic Patent References:
| JP59162185A | ||||
| JP2092875A |
Attorney, Agent or Firm:
Kazumi Murase