Title:
THERMALLY CONDUCTIVE ELECTRICALLY CONDUCTIVE ADHESIVE COMPOSITION
Document Type and Number:
Japanese Patent JP2015224329
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermally conductive electrically conductive adhesive composition used as a die bond material and having high thermal conductivity and stable electric conductivity.SOLUTION: There is provided the thermally conductive electrically conductive adhesive composition containing (A) an electrically conductive filler, (B) an epoxy resin, (C) a reactive diluent and (D) a curing agent, (A) is a silver powder having an average particle diameter of 1 to 10 μm and in an amount ranging from 85 to 94 mass% based on the total amount of the composition, (B) is for example a bisphenol F type epoxy resin in an amount ranging from 1 to 8 mass% based on the total amount of the composition, (C) is for example 1,4-butanediol diglycidyl ether in an amount ranging from 0.2 to 5 mass% based on the total amount of the composition, and (D) is for example 4,4'-diaminodiphenyl sulfone in an amount ranging from 0.2 to 3 mass% based on the total amount of the composition.
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Inventors:
ABE SHINTARO
FURUSHO RIKIA
FURUSHO RIKIA
Application Number:
JP2014111769A
Publication Date:
December 14, 2015
Filing Date:
May 29, 2014
Export Citation:
Assignee:
TANAKA PRECIOUS METAL IND
International Classes:
C09J163/00; C09J9/02; C09J11/04; C09J11/06; C09J109/00
Domestic Patent References:
| JP2012532942A | 2012-12-20 | |||
| JP2013214733A | 2013-10-17 | |||
| JP2014125596A | 2014-07-07 | |||
| JP2013175559A | 2013-09-05 | |||
| JP2007197498A | 2007-08-09 | |||
| JP2000239636A | 2000-09-05 |
Attorney, Agent or Firm:
Patent business corporation glory patent office
Yuriko Hamada
Furudate Kutanko
Tomoko Yamazaki
Yuriko Hamada
Furudate Kutanko
Tomoko Yamazaki