Title:
熱伝導性絶縁接着シート、および該シートの製造方法
Document Type and Number:
Japanese Patent JP7139600
Kind Code:
B2
Abstract:
To provide a heat conducting insulative adhesive sheet by which a composite member superior to conventional one in heat conduction, especially insulation reliability performance can be formed in a heating/pressurizing step of less than one hour.SOLUTION: A heat conducting insulative adhesive sheet comprises: a plurality of layers (A); and at least one layer (B). The plurality of layers (A) and the at least one layer (B) are alternately laminated so that the layer (B) is never located on the outmost side. The at least one layer (B) is an uncured product and/or half-cured product of a thermosetting composition, which comprises a thermally conductive filler (F), a thermosetting resin (R), a curing agent (C), and a curing accelerator (D). A mass of the thermally conductive filler (F) included in the outermost layer (A) of the plurality of layers (A), located on the outmost side, is relatively larger than that of the thermally conductive filler (F) which the layer (B) may contain.SELECTED DRAWING: None
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Inventors:
Kenji Ando
Toichi Sawaguchi
Kaori Sakaguchi
Toichi Sawaguchi
Kaori Sakaguchi
Application Number:
JP2017248713A
Publication Date:
September 21, 2022
Filing Date:
December 26, 2017
Export Citation:
Assignee:
Toyo Ink sc Holdings Co., Ltd.
International Classes:
H01L23/373; B32B27/20; B32B27/26; H01L23/36
Domestic Patent References:
JP2004217862A | ||||
JP2009194353A |
Foreign References:
WO2017154962A1 |