Title:
熱伝導性シート及びその製造方法
Document Type and Number:
Japanese Patent JP6963100
Kind Code:
B2
Abstract:
A thermally conductive sheet 10 contains a matrix resin 11, filler molded pieces 12 containing a first thermally conductive filler 15 with shape anisotropy, and a second thermally conductive filler 13. The filler molded pieces 12 contain a binder resin 14 and the first thermally conductive filler 15. The first thermally conductive filler 15 is oriented in the thickness direction of each of the filler molded pieces 12. The first thermally conductive filler 15 is also oriented in the thickness direction of the thermally conductive sheet 10 when present in the thermally conductive sheet 10. This configuration provides a thermally conductive sheet with a high thermal conductivity and a large size, and a method for producing the thermally conductive sheet.
More Like This:
| JP7108110 | MIMO antenna device |
| JPH04199736 | MANUFACTURE OF PIN TYPE RADIATION FIN |
| JPS60141141 | [Title of the device] Heat sink structure of an integrated circuit |
Inventors:
Katsuyuki Suzumura
Application Number:
JP2020516496A
Publication Date:
November 05, 2021
Filing Date:
October 10, 2019
Export Citation:
Assignee:
Fuji Polymer Industry Co., Ltd.
International Classes:
H01L23/36; H05K7/20
Domestic Patent References:
| JP2000294700A |
Attorney, Agent or Firm:
Patent business corporation Ikeuchi and Partners
Previous Patent: Guide wire
Next Patent: Magnetic Recording Read-Actuator Tilt Interposer for In-row Wrapping Mount Tool for Write Head
Next Patent: Magnetic Recording Read-Actuator Tilt Interposer for In-row Wrapping Mount Tool for Write Head