Title:
熱伝導性シリコーン組成物
Document Type and Number:
Japanese Patent JP7001071
Kind Code:
B2
Abstract:
This thermally-conductive silicone composition contains specific proportions of(A) an organopolysiloxane having a thixotropic index α of 1.51-2.00, and a viscosity of 10-1,000,000 mPa·s as measured at 25°C using a B-type rotational viscometer at a rotor rotational speed of 2 rpm(provided that the thixotropic index α is a value calculated by α = η1/η2, where η1 and η2 respectively represent viscosities at rotor rotational speeds of 2 rpm and 4 rpm, as measured at 25°C using a B-type rotational viscometer),(B) a thermally-conductive inorganic filler having a Mohs hardness not more than 5 and an average particle size of 0.1-200 µm, and(C) a volatile solvent in which the components (A) and (B) can be dispersed or dissolved,wherein the thermally-conductive silicone composition does not contain a thermally-conductive inorganic filler having a Mohs hardness of more than 5. This thermally-conductive silicone composition does not cause damage to a silicon chip, and has excellent workability and displacement resistance.
Inventors:
Kunihiro Yamada
Application Number:
JP2019002591A
Publication Date:
January 19, 2022
Filing Date:
January 10, 2019
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L83/04; C08K3/013
Domestic Patent References:
| JP2017002179A |
Attorney, Agent or Firm:
Hideaki International Patent Office
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