THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION

Title:

THERMALLY CONDUCTIVE SILICONE GREASE COMPOSITION

Document Type and Number:

Japanese Patent JP2014105283

Kind Code:

A

Abstract:

To provide a thermally conductive silicone grease composition which has low viscosity but hardly causes slipping even under a vertical environment.

The thermally conductive silicone grease composition comprises, as essential components, (A) 100 pts.mass of an organopolysiloxane represented by the specified formula (1) (R¹ is a substituted or unsubstituted monovalent hydrocarbon group; R² is an alkyl, alkoxyalkyl, alkenyl or acyl group; n is between 2 and 100; and a is between 1 and 3), (B) 0.1-50 pts.mass of an alkoxysilane represented by the general formula (2) defined by R³_bR⁴_cSi(OR⁵)_4-b-c (R³ is a C6-C20 unsubstituted alkyl group; R⁴ is a C1-C20 substituted or unsubstituted monovalent hydrocarbon group; R⁵ is a C1-C6 alkyl group; b is between 1 and 3; c is 0, 1 or 2; and b+c is between 1 and 3), (C) 100-2,500 pts.mass of a thermally conductive filler having thermal conductivity of 10 W/(m °C) or more, and (D) 0.1-100 pts.mass of surface-treated aerosol silica.

Inventors:

MATSUMOTO NOBUAKI

Application Number:

JP2012259295A

Publication Date:

June 09, 2014

Filing Date:

November 28, 2012

Export Citation:

Click for automatic bibliography generation Help

Assignee:

SHINETSU CHEMICAL CO

International Classes:

C08L83/06; C08K5/5419; C08K9/00; C08L83/04; C09K5/00; C10M107/50; C10M125/04; C10M125/10; C10M125/26; C10M139/06; C10M169/00; H01L23/36; C10N20/00; C10N30/00; C10N40/00; C10N50/10

Domestic Patent References:

JP2007177001A	2007-07-12
JP2009096961A	2009-05-07
JP2008274036A	2008-11-13
JP2009286855A	2009-12-10
JP2011140566A	2011-07-21
JP5733087B2	2015-06-10

Attorney, Agent or Firm:

Takashi Kojima
Saori Shigematsu
Katsunari Kobayashi
Takeshi Ishikawa

Previous Patent: INK COMPOSITION

Next Patent: RESIN MOLDED BODY AND RESIN LAMINATE