Title:
THERMALLY EXPANSIBLE MICROCAPSULE AND ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2004181308
Kind Code:
A
Abstract:
To provide a thermally expansible microcapsule having a sufficient gas jet quantity, and an adhesive sheet using the same.
The thermally expansible microcapsule is obtained by microencapsulating a volatile expanding agent, which becomes gaseous at a temperature not higher than the softening point of a shell polymer, by the shell polymer, which is prepared by polymerizing a vinyl monomer containing at least 50-80 wt.% of a nitrile monomer component and 50 wt.% or less of a non-nitrile monomer component and contains an azo compound. A ratio of a (meth)acrylic ester in the vinyl monomer is 20-50 wt.%.
Inventors:
KAWAGUCHI YASUHIRO
HATAKEI MUNEHIRO
FUKUOKA MASATERU
HAYASHI SATOSHI
DANJO SHIGERU
OYAMA YASUHIKO
HATAKEI MUNEHIRO
FUKUOKA MASATERU
HAYASHI SATOSHI
DANJO SHIGERU
OYAMA YASUHIKO
Application Number:
JP2002349295A
Publication Date:
July 02, 2004
Filing Date:
November 29, 2002
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
B01J13/14; C09J7/02; C09J11/00; C09J201/00; (IPC1-7): B01J13/14; C09J7/02; C09J11/00; C09J201/00
Domestic Patent References:
| JP2000191817A | 2000-07-11 | |||
| JPS6330581A | 1988-02-09 | |||
| JPS62286534A | 1987-12-12 | |||
| JPH0527783U | 1993-04-09 |
Previous Patent: ORGANIC WASTE TREATMENT APPARATUS
Next Patent: WATER SEALING STRUCTURE OF WASTE DISPOSAL PLANT AND CONSTRUCTION METHOD THEREFOR
Next Patent: WATER SEALING STRUCTURE OF WASTE DISPOSAL PLANT AND CONSTRUCTION METHOD THEREFOR