Title:
THERMALLY FUSIBLE INSULATING SHEET
Document Type and Number:
Japanese Patent JP3514667
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a thermally fusible insulating sheet for electrically insulating between a printed wiring board and objects to be bonded, which exhibits a high heat resistance and a flowability suitable for bonding between the printed wiring board and the objects to be bonded when it is heated at a low temperature of 260°C or less in a relatively short time.
SOLUTION: The thermally fusible insulating sheet 2 is formed of a thermoplastic resin composite containing 65-35 wt.% of polyallylketone resin exhibiting 260°C or higher of crystal fusion peek temperature and 35-65 wt.% of amorphous polyetherimide resin. The thermoplastic resin composite is a thermally fusible insulating sheet 2 exhibiting characteristics, such that the glass transfer temperature measured at the time of temperature rising by differential scanning calorimetry and the relation between the crystal fusion calorie ΔHm and the crystallization calorie ΔHc generated by crystallization during temperature rising is shown as the following formula (I): [(ΔHm-ΔHc)/ΔHm]≤0.5.
Inventors:
Yamada, Shingetsu
Takagi, Jun
Taniguchi, Koichiro
Miyake, Toshihiro
Kojima, Katsuaki
Takagi, Jun
Taniguchi, Koichiro
Miyake, Toshihiro
Kojima, Katsuaki
Application Number:
JP18584499A
Publication Date:
March 31, 2004
Filing Date:
June 30, 1999
Export Citation:
Assignee:
MITSUBISHI PLASTICS IND LTD
DENSO CORP
DENSO CORP
International Classes:
H05K3/46; C08J5/12; C08J5/18; C08L71/10; C08L73/00; C08L79/08; C09J7/02; C09J171/10; H05K1/05; (IPC1-7): H05K3/46; C08J5/12; C08L71/10; C08L73/00; C08L79/08; C09J7/02; H05K1/05
Attorney, Agent or Firm:
鎌田 文二 （外２名）