Title:
熱圧着方法
Document Type and Number:
Japanese Patent JP4250488
Kind Code:
B2
Abstract:
A thermal contact-bonding method employs a thermal contact-bonding apparatus including at least a hot plate, an upper chamber, and a resin sheet provided at a lower portion of the upper chamber. The method includes the steps of pressing the upper chamber against the hot plate, while at least a part of a surface of the hot plate is separated from the resin sheet, to be in a stand-by state of the thermal contact-bonding apparatus, for a time of not charging a material to be processed, charging the material to be processed between the resin sheet and the hot plate, and subjecting the material to be processed to a thermal contact-bonding processing by making a space between the resin sheet and the hot plate under a vacuum state.
Inventors:
Takanori Takeyama
Application Number:
JP2003322563A
Publication Date:
April 08, 2009
Filing Date:
September 16, 2003
Export Citation:
Assignee:
Canon Inc
International Classes:
B29C65/48; H01L31/04; H01L31/18; B29L9/00; B29L31/34
Domestic Patent References:
| JP9057779A | ||||
| JP5131545A | ||||
| JP2000286437A | ||||
| JP2002347115A | ||||
| JP4029037U |
Attorney, Agent or Firm:
Keisuke Watanabe
Yoshihiro Yamaguchi
Yoshihiro Yamaguchi