THERMOCOUPLING CELL

Title:

THERMOCOUPLING CELL

Document Type and Number:

Japanese Patent JPS581214

Kind Code:

A

Abstract:

1. A thermal coupling cell between a heat producing element with semiconductors and a heat-sensitive element for the temperature stabilisation of an enclosure, especially intended for a piezo-electric oscillator, the heat-sensitive element being disposed close to the heat producing element (3), the two elements being mounted on an insulating support (1) and being interconnected by a metallic conductor (5), characterized in that said insulating support is a heat conductor and that the metallic conductor (5) is disposed on the support and comprises three parts, the first one being in thermal contact with the heat-sensitive element, the second one being in thermal contact with the heat producing element and the third part having adjustable dimensions and thermally connecting the first to the second part.

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Inventors:

JIERAARU MAROTERU
DEIDEIE PURIBA

Application Number:

JP9562382A

Publication Date:

January 06, 1983

Filing Date:

June 05, 1982

Export Citation:

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Assignee:

CEPE

International Classes:

G01K7/16; G05D23/00; G05D23/24; G05D23/30; H01L23/34; H03L1/04; (IPC1-7): G01K7/16; G05D23/20

Attorney, Agent or Firm:

Wakabayashi Tadashi

Next Patent: INFORMATION PROCESSOR AND INFORMATION PROCESSING SYSTEM