Title:
THERMODYNAMICS ENGINE, ELECTRONIC BODY STRUCTURE, HEAT SWITCH AND INTEGRATED CIRCUIT BODY STRUCTURE
Document Type and Number:
Japanese Patent JPH07297457
Kind Code:
A
Abstract:
PURPOSE: To provide a small thermodynamic engine suitable for cooling an integrated circuit without using any component for sliding contact, by providing a solid thermodynamic member between two heat exchange members at least one of which is formed by using micro-mechanical work. CONSTITUTION: By selectively etching the surface of a die 200 of a heat exchange member, a ring-shaped groove 206 and an array 208 of linear grooves extending like parallel chords with respect to the ring-shaped channel are formed. A die 210 of another heat exchange member is similarly processed, and these two dies are laid out. In this case, the surfaces of these dies are caused to contact each other to make the ring-shaped grooves concentric, and two sets of linear grooves determined respectively on the two dies are caused to be parallel. At least one of the heat exchange members is formed by using micro-mechanical work. Using two parallel plate devices 330 produced as heat exchangers and a thermodynamic member 310 made of silicon provided between these plate devices, a thermo-acoustic engine is assembled.
Inventors:
KINBARII EMU GATSUDOSHIYAAKU
BURUUSU MAADOTSUKU
BURUUSU MAADOTSUKU
Application Number:
JP11120995A
Publication Date:
November 10, 1995
Filing Date:
April 12, 1995
Export Citation:
Assignee:
TEKTRONIX INC
International Classes:
H01L39/22; F02G1/053; F25B9/14; F28D9/00; H01L23/34; H01L23/44; H01L39/04; (IPC1-7): H01L39/04; H01L39/22
Attorney, Agent or Firm:
Sony Tektronix Inc.