Title:
熱電モジュール及び光モジュール
Document Type and Number:
Japanese Patent JP7461138
Kind Code:
B2
Abstract:
To provide a thermoelectric module capable of suppressing generation of electrical short-circuit or disconnection.SOLUTION: A thermoelectric module 1 includes: a pair of substrates 2; a thermoelectric element 3 arranged between the pair of substrates 2; a junction part 7 joining the substrate 2 to the thermoelectric element 3; a base film 10 for sealing between the pair of substrates 2; and an organic material film 11 covering a surface of the base film 10.SELECTED DRAWING: Figure 2
Inventors:
Takaaki Ota
Application Number:
JP2019229192A
Publication Date:
April 03, 2024
Filing Date:
December 19, 2019
Export Citation:
Assignee:
Kelk corporation
International Classes:
H10N10/17; H01S5/022; H10N10/817; H10N10/82
Domestic Patent References:
| JP2003332644A | ||||
| JP2015079839A | ||||
| JP2010192764A | ||||
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Foreign References:
| WO2018179544A1 | ||||
| WO2015163105A1 | ||||
| WO2018181660A1 |
Attorney, Agent or Firm:
Sakai International Patent Office