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Title:
THERMOPLASTIC MOLDING COMPOSITION
Document Type and Number:
Japanese Patent JPH06207100
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermoplastic molding composition having a high m.p., a high glass transition temp., high thermal formation stability and a high crystal degree by adding prescribed amts. of a filler, a rubber elasticity copolymer or the like, to a partially arom. copolyamide having a specified compsn.

CONSTITUTION: A partially arom. copolyamide comprising 50-90 wt.% units derived from terephthalic acid and hexamethylenediamine, 5-30 wt.% units derived from -caprolactam and 5-30 wt.% units derived from isophthalic acid and hexamethylenediamine is prepd. and 60-100 wt.% of the partially arom. copolyamide is mixed with 0-40 wt.% fibrous or particulate filler such as calcium silicate, 0-40 wt.% rubber elasticity copolymer such as ethylene- propylene-diene rubber and 0-30 wt.% ordinary additives and processing aids to produce the objective thermoplastic molding composition.


Inventors:
BUARUTAA GEETSU
GUNTAA PITSUPAA
Application Number:
JP25813793A
Publication Date:
July 26, 1994
Filing Date:
October 15, 1993
Export Citation:
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Assignee:
BASF AG
International Classes:
C08G69/26; C08G69/28; C08G69/36; C08K7/00; C08L9/00; C08L21/00; C08L77/00; (IPC1-7): C08L77/00; C08G69/26; C08K7/00; C08L9/00
Attorney, Agent or Firm:
Toshio Yano (2 outside)