Title:
THERMOPLASTIC RESIN COMPOSITION FOR ELECTRICAL AND ELECTRONIC COMPONENTS HAVING CONTACT AND ELECTRICAL AND ELECTRONIC COMPONENTS HAVING CONTACT
Document Type and Number:
Japanese Patent JP3817616
Kind Code:
B2
Abstract:
PURPOSE: To obtain a thermoplastic resin composition for electrical and electronic components, improved in reliability of contact, flame retardancy, etc., by mixing a thermoplastic resin with a halogenated aromatic compound, a double salt of a specified alkali metal oxide and antimony pentaoxide and a polyhydric alcohol(derivative).
CONSTITUTION: This composition is prepared by mixing 100 pts.wt. thermoplastic resin of an intrinsic viscosity of 0.7-1.4dl/g with 5-40 pts.wt. double salt of an alkali metal oxide represented by the formula: (X2O)n.Sb2O5 or (YO)n.Sb2O5 (wherein X is a monovalent alkali metal element; Y is a bivalent alkaline earth metal element; and n is the compositional ratio of the X2O or YO to the Sb2O5 and is 0.7 or above) and having a release rate of adsorbed water of 50min or below with antimony pentaoxide and optionally 0.2-10 pts.wt. polyhydric alcohol(derivative).
Inventors:
Yutaka Takenaka
Kenji Funaki
Toshiyuki Furuya
Shigeru Muramatsu
Yoshitaka Kanazawa
Kimura Osamu
Kenji Funaki
Toshiyuki Furuya
Shigeru Muramatsu
Yoshitaka Kanazawa
Kimura Osamu
Application Number:
JP34021794A
Publication Date:
September 06, 2006
Filing Date:
December 28, 1994
Export Citation:
Assignee:
OMRON Corporation
Mitsubishi Engineering Plastics Co., Ltd.
Mitsubishi Engineering Plastics Co., Ltd.
International Classes:
C08K3/22; C08L101/00; C08K3/00; C08K5/053; C08L59/00; C08L67/00; C08L69/00; C08L77/00; C08L81/02; H01H1/02; H01H1/029; (IPC1-7): C08K3/22; C08L59/00; C08L69/00; C08L77/00; C08L81/02; H01H1/02; //C08L67/00
Domestic Patent References:
| JP4351657A | ||||
| JP60058453A | ||||
| JP61235454A |
Attorney, Agent or Firm:
Kyosei International Patent Office
Namba Kunihide
Namba Kunihide