THERMOPLASTIC RESIN COMPOSITION, ITS MOLDED ARTICLE AND PRODUCTION THEREOF

Title:

THERMOPLASTIC RESIN COMPOSITION, ITS MOLDED ARTICLE AND PRODUCTION THEREOF

Document Type and Number:

Japanese Patent JP3652790

Kind Code:

B2

Abstract:

PROBLEM TO BE SOLVED: To obtain a thermoplastic resin composition that contains a specific copolymer composition and a light stabilizer, can be molded directly in combination with an ABS-based resin, imparts the ABS resin with excellent thermal and light resistance, and is useful for automotive parts, electric and electronic appliances, etc.
SOLUTION: This thermoplastic resin composition comprises (A) 0-40wt.% of a maleimide-based copolymer, (B) 10-95wt.% of a acrylonitrile-styrene based (ABS) copolymer, (C) an acrylonitrile-butadiene-styrene based graft copolymer, and (D) 5-30wt.% of a light stabilizer, such as a benzophenone derivative or benzotriazole derivative, in such preparation that the total of components A to D is 100%, and that the resin composition has melt viscosity of 20,000 poise or less at temperature of 260°C and at the shearing rate of 60±5sec.

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Inventors:

Kunihiko Konishi
Tetsuya Niimura

Application Number:

JP16317296A

Publication Date:

May 25, 2005

Filing Date:

June 24, 1996

Export Citation:

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Assignee:

DENKI KAGAKU KOGYO KABUSHIKI KAISHA

International Classes:

C08L25/12; C08K5/3435; C08K5/3495; C08L55/00; C08L55/02; (IPC1-7): C08L25/12; C08K5/3435; C08K5/3495; C08L55/02

Domestic Patent References:

JP63258944A
JP7268153A
JP6143391A
JP6145467A
JP8012810A
JP7316384A

Other References:

ポリマー辞典,日本,大成社出版部,1971年 3月10日,第2版,p.396

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