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Title:
THERMOPLASTIC RESIN COMPOSITION AND ITS MOLDING
Document Type and Number:
Japanese Patent JP2005036200
Kind Code:
A
Abstract:

To provide a thermoplastic resin composition having improved antistatic properties, a reduced friction coefficient and improved wear and pollution resistance while retaining mechanical strength, moldability and thermal stability characteristic of thermoplastic resins and a molding thereof.

The composition consists of (a) a thermoplastic polycarbonate resin derived from (A) a polyorganosiloxane compound having hydroxyphenyl groups at both ends and (B) a bisphenol compound, blended with (b) carbon fibers of an average fiber diameter ≤200 nm, in a ratio of (b) of 0.1-30 pts. wt. to 100 pts. wt. of (a).


Inventors:
ADACHI TAKAHIRO
OGAWA NORIYOSHI
Application Number:
JP2004164330A
Publication Date:
February 10, 2005
Filing Date:
June 02, 2004
Export Citation:
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Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
B65D65/02; C08K7/06; C08L69/00; (IPC1-7): C08L69/00; B65D65/02; C08K7/06
Domestic Patent References:
JPH07207140A1995-08-08
JP2003055544A2003-02-26
JPH04268362A1992-09-24
JPH0770423A1995-03-14
JP2001310994A2001-11-06
JP2002053747A2002-02-19
Attorney, Agent or Firm:
Takashi Nagai