Title:
THERMOPLASTIC RESIN COMPOSITION AND ITS MOLDING
Document Type and Number:
Japanese Patent JP2005036200
Kind Code:
A
Abstract:
To provide a thermoplastic resin composition having improved antistatic properties, a reduced friction coefficient and improved wear and pollution resistance while retaining mechanical strength, moldability and thermal stability characteristic of thermoplastic resins and a molding thereof.
The composition consists of (a) a thermoplastic polycarbonate resin derived from (A) a polyorganosiloxane compound having hydroxyphenyl groups at both ends and (B) a bisphenol compound, blended with (b) carbon fibers of an average fiber diameter ≤200 nm, in a ratio of (b) of 0.1-30 pts. wt. to 100 pts. wt. of (a).
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Inventors:
ADACHI TAKAHIRO
OGAWA NORIYOSHI
OGAWA NORIYOSHI
Application Number:
JP2004164330A
Publication Date:
February 10, 2005
Filing Date:
June 02, 2004
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
B65D65/02; C08K7/06; C08L69/00; (IPC1-7): C08L69/00; B65D65/02; C08K7/06
Domestic Patent References:
JPH07207140A | 1995-08-08 | |||
JP2003055544A | 2003-02-26 | |||
JPH04268362A | 1992-09-24 | |||
JPH0770423A | 1995-03-14 | |||
JP2001310994A | 2001-11-06 | |||
JP2002053747A | 2002-02-19 |
Attorney, Agent or Firm:
Takashi Nagai