THERMOPLASTIC RESIN COMPOSITION WITH HIGH THERMAL CONDUCTIVITY

Title:

THERMOPLASTIC RESIN COMPOSITION WITH HIGH THERMAL CONDUCTIVITY

Document Type and Number:

Japanese Patent JP2007321138

Kind Code:

A

Abstract:

To provide an inorganic substance-containing thermoplastic resin composition having excellent thermal conductivity while practically retaining various properties inherent in general-purpose resins, such as mechanical properties and moldability.

The resin composition is a polymer alloy comprising a polycarbonate resin, a thermoplastic silicone resin, and a highly thermally conductive inorganic compound. In the polymer alloy, the thermoplastic silicone resin forms a continuous phase, and the highly thermally conductive inorganic compound is present preferentially in phases other than the polycarbonate resin. As a result, by adding a relatively small amount of the highly thermally conductive inorganic compound, the thermal conductivity of the composition can be efficiently improved.

Inventors:

MATSUMOTO KAZUAKI

Application Number:

JP2006156633A

Publication Date:

December 13, 2007

Filing Date:

June 05, 2006

Export Citation:

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Assignee:

KANEKA CORP

International Classes:

C08L69/00; C08K3/00; C08L83/04

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