To obtain a thermoplastic resin composition capable of exhibiting properties excellent in heat resistance, recyclability and the like by compounding a polyphenylene ether resin and a polystyrene resin, a polyester resin, and a resin having an effect to bond these resins without using a specific compatibilizer.

This composition is composed of (A) (i) a polyphenylene ether resin [e.g. poly(2,6-dimethylphenylene-1,4-ether) or the like] and (ii) a polystyrene resin (e.g. polystyrene, a styrene-α-methylstyrene copolymer, or the like), (B) a polyester resin (e.g. a thermoplastic polyester such as polyethylene terephthalate, or the like) and (C) a resin having an effect to adhering the components (A) and (B) (preferably, a hot melt adhesive resin). The composition preferably contains 65-95 pts.wt. of the component A and 5-40 pts.wt. of the component B, and 1-10 pts.wt. of the component C based on 100 pts.wt. of the total of the components A and B.