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Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0726135
Kind Code:
A
Abstract:

PURPOSE: To obtain a thermoplastic resin composition useful as outside plate material of automobile, building material, etc., having excellent impact resistance, adhesiveness of coating film, heat stability and processability, comprising a polyphenylene ether and a polyamide as main components in a specific ratio.

CONSTITUTION: (A) 1-60wt.% of a polyphenylene ether (preferably homopolymer of 2,6-dimethylphenol) and (B) 40-99wt.% of a polyamide (preferably nylon 46 or nylon 6) are mixed with (C) 1-50 pts.wt. of a hydogenated conjugated diene- alkenyl aromatic random copolymer (hydrogenated styrene-butadiene random copolymer having preferably 10-40wt.% styrene amount) having ≤10,000kg/cm2 modulus of elasticity at normal temperature based on 100 pts.wt. of the total of the components A and B and (D) a compatibilizing agent (preferably maleic anhydride, maleic acid, fumaric acid, etc.) in a sufficient amount to compatibilize the component A and the component B (preferably 0.05-25 pts.wt. based on 100 pts.wt. of the total of the components A and B) to give the objective composition.


Inventors:
HAGIMORI HIROSHI
SANADA TAKASHI
Application Number:
JP17443793A
Publication Date:
January 27, 1995
Filing Date:
July 14, 1993
Export Citation:
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Assignee:
SUMITOMO CHEMICAL CO
International Classes:
C08K5/00; C08K5/09; C08L25/10; C08L71/00; C08L71/12; C08L73/00; C08L77/00; (IPC1-7): C08L71/12; C08K5/00; C08K5/09; C08L25/10; C08L71/12; C08L77/00
Attorney, Agent or Firm:
Takashi Kuboyama (1 person outside)