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Patent Searching and Data


Title:
THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH09217005
Kind Code:
A
Abstract:

To obtain a thermoplastic resin composition excellent in molding flowability and capable of imparting molded articles excellent in impact resistance, heat deformation resistance, molding flowability and surface appearance by containing a rubber component treated to enlarge particle size.

This thermoplastic resin composition comprises (A) 5-95 pts.wt. of a polyamide resin, (B) 5-95 pts.wt. of an unsaturated carboxylic acid- containing copolymer which comprises 40-80wt.% aromatic vinyl compound, 15-50wt.% vinyl cyanide compound, 0.1-20wt.% unsaturated carboxylic acid compound and 0-30wt.% other copolymerizable vinyl-based compound and (C) 5-50 pts.wt. graft copolymer obtained by graft polymerizing 60-5wt.% vinyl-based compound in the presence of 40-90wt.% particle enlarged rubber having 0.1-2.0μm average particle size and obtained by adding (D) 0.1-15wt.% acid group- containing copolymer latex having 0.05-0.5μm average particle size and treating to enlarge the particle size. The component D comprises 5-20wt.% unsaturated acid monomer such as acrylic acid, 5-30wt.% alkyl acrylate monomer and 20-80wt.% alkyl methacrylate monomer, etc.


Inventors:
KOBAYASHI HIROSHI
ASADA MASAHIRO
Application Number:
JP4792296A
Publication Date:
August 19, 1997
Filing Date:
February 10, 1996
Export Citation:
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Assignee:
KANEGAFUCHI CHEMICAL IND
International Classes:
C08L25/12; C08F279/00; C08F279/02; C08L51/04; C08L73/00; C08L77/00; (IPC1-7): C08L77/00; C08L25/12; C08L51/04
Attorney, Agent or Firm:
Kenji Itami