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Title:
THERMOPLASTIC RESIN SHEET FOR MOLDING AND ITS MANUFACTURE
Document Type and Number:
Japanese Patent JPH01291924
Kind Code:
A
Abstract:

PURPOSE: To mold a molded product of uniform strength and electromagnetic wave masking effect by means of uniform dispersion by retaining powder or grains of thermoplastic resin in the spaces of a structures constituted of conductive fibers entangled at random such as metallic fibers, metal plated non-metallic fibers or the like.

CONSTITUTION: An air-permeable network-shaped structure A is constituted of point contact or line contact of conductive fibers 1 entangled at random, and solid contents 2 are retained in its spaces. Such a sheet is heated, melted and used as a molding material for embossing. The conductive fibers 1 are discountinuous single fibers of 1W18μm diameters, and anticorrosion metallic fibers or anticorrosion plated iron fibers, or non-metallic fibers metal plated with copper, nickel or the like are used. As for the thermoplastic resin included in a solid content 2, synthetic resin powder or grains are used. Conductive fibers M of 5W50mm length and powder or grains P of thermoplastic resin of 0.3W2.0mm grain diameters are floated in the liquid mediums and dispersed therein, and floating substances F are removed and then its liquid content is removed to form a web W to manufacture a sheet.


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Inventors:
HIDA AKIRA
Application Number:
JP12407588A
Publication Date:
November 24, 1989
Filing Date:
May 20, 1988
Export Citation:
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Assignee:
HIDA AKIRA
International Classes:
B29C70/06; B29B11/16; B29B15/08; C08J5/04; B29K105/06; (IPC1-7): B29C67/14; B29K105/06; C08J5/04
Domestic Patent References:
JPS5728135A1982-02-15