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Title:
THERMOSENSITIVE SELF-ADHESIVE MATERIAL
Document Type and Number:
Japanese Patent JP2009013382
Kind Code:
A
Abstract:

To provide a thermosensitive self-adhesive material which is superior in blocking property when not active and which has adequate self-adhesion in a wide temperature range to an adherend with little smoothness such as corrugated fiberboard.

(1) The thermosensitive self-adhesive material has a thermosensitive self-adhesive layer containing as main components a thermoplastic resin and a thermofusible substance melted by heating at least on one surface of a support, wherein the thermoplastic resin contains as a main component a (meth)acrylic copolymer in which acrylonitrile of a monomer component occupies 5-20% by weight and the glass transition temperature of the copolymer is in the range of (-70)-(-30)C. (2) In the thermosensitive self-adhesive material, the (meth)acrylic copolymer contains 2-ethyl hexyl acrylate as a main component.


Inventors:
SHINPO HITOSHI
YAMAGUCHI TAKEHITO
KUGA YUTAKA
MORITA MITSUNOBU
SASAKI TAKAYUKI
Application Number:
JP2007180258A
Publication Date:
January 22, 2009
Filing Date:
July 09, 2007
Export Citation:
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Assignee:
RICOH KK
International Classes:
C09J4/02; B32B27/30; B41M5/28; B41M5/30; B41M5/337; B41M5/40; C09J7/02; G03G9/00; G09F3/02; G09F3/10
Domestic Patent References:
JP2006111865A2006-04-27
JP2006083196A2006-03-30
JP2000256631A2000-09-19
Attorney, Agent or Firm:
Eiji Tomomatsu