THERMOSETTING ADHESIVE COMPOSITION AND BONDED STRUCTURE USING SAME

Title:

THERMOSETTING ADHESIVE COMPOSITION AND BONDED STRUCTURE USING SAME

Document Type and Number:

Japanese Patent JP2001107009

Kind Code:

A

Abstract:

To provide thermosetting adhesive compositions having desired properties advantageous to the adhesion of electronic parts even when cured with a reduced exposed dose of radiation such as electron rays.

Thermosetting adhesive compositions contain (a) an ethylene/ glycidyl (meth)acrylate copolymer, (b) a carboxyl group-containing rosin, and (c) a carboxyl group-containing (meth)acrylate.

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Inventors:

CHOKAI NAOYUKI
ISHII SHIGEYOSHI
KAWATE KOICHIRO
ITO KOJI
TAKEDA MASAO

Application Number:

JP27913199A

Publication Date:

April 17, 2001

Filing Date:

September 30, 1999

Export Citation:

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Assignee:

THREE M INNOVATIVE PROPERTIES

International Classes:

C09J163/00; C08F4/06; C08F8/14; C09J4/06; C09J123/08; C09J133/14; C09J193/04; (IPC1-7): C09J163/00; C09J123/08; C09J133/14; C09J193/04

Attorney, Agent or Firm:

Aoyama Ryo (1 person outside)

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