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Title:
THERMOSETTING COMPOSITION, CURED FILM, SUBSTRATE WITH CURED FILM, ELECTRONIC COMPONENT, AND DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2016160420
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition that can form a cured film having excellent chemical resistance and adhesiveness to a substrate (adherend) such as glass in a well-balanced manner; a color ink for ink jet printing using the composition; and a touch panel using the color ink.SOLUTION: A thermosetting composition contains a resin (A) having styrene and a maleic anhydride structure, and an epoxy compound (B) having a 9,9-bisphenyl fluorene skeleton, and further contains a silsesquioxane-containing epoxy compound (D).SELECTED DRAWING: None

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Inventors:
HIROTA TAKAYUKI
MUROTANI ATSUSHI
DEYAMA YOSHIHIRO
SUGIHARA KATSUYUKI
Application Number:
JP2015043848A
Publication Date:
September 05, 2016
Filing Date:
March 05, 2015
Export Citation:
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Assignee:
JNC CORP
International Classes:
C08G59/24; C08G59/38; C08G59/42; C09D11/324; G06F3/041
Domestic Patent References:
JP2012128273A2012-07-05
JP2011231247A2011-11-17
JPH05156128A1993-06-22
JP2005338790A2005-12-08
JP2007308682A2007-11-29
JP2008150478A2008-07-03
JP2009062436A2009-03-26
JP2009167390A2009-07-30
JP2009245715A2009-10-22
JP2012145699A2012-08-02
Foreign References:
WO2015012395A12015-01-29
WO2015012381A12015-01-29
WO2004024741A12004-03-25
Attorney, Agent or Firm:
Patent corporation ssinpat



 
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