Title:
熱硬化性樹脂組成物、ドライフィルム、硬化物、および、電子部品
Document Type and Number:
Japanese Patent JP7169076
Kind Code:
B2
Abstract:
Provided is a thermosetting resin composition that can achieve both low Dk and low CTE of a cured product, and ensures satisfactory storage stability of a dry film. The thermosetting resin composition includes: (A) an epoxy resin, (B) a curing agent, (C) silica, (D) a filler comprising at least one of polytetrafluoroethylene and a copolymer of tetrafluoroethylene and an ethylenically unsaturated compound represented by the following general formula (1). The curing agent (B) is at least one of a compound having a phenolic hydroxyl group, a compound having an active ester group, a compound having a cyanate ester group, and a compound having a maleimide group. (In the general formula (1), R1 to R4 each independently represent a hydrogen atom, a fluorine atom, an alkyl group or -ORf, and the Rf is an alkyl group including at least a fluorine atom, with the proviso that the R1 to R4 are all fluorine atoms.)
Inventors:
Endo Arata
Application Number:
JP2018055281A
Publication Date:
November 10, 2022
Filing Date:
March 22, 2018
Export Citation:
Assignee:
Taiyo Ink Manufacturing Co., Ltd.
International Classes:
C08L63/00; C08G59/40; C08K3/36; C08L27/18; H05K1/03
Domestic Patent References:
| JP2017165876A | ||||
| JP2016166347A | ||||
| JP2009138074A | ||||
| JP58068955A | ||||
| JP2001040182A | ||||
| JP2018012775A | ||||
| JP2015189848A | ||||
| JP2014210843A | ||||
| JP2016074849A | ||||
| JP2015010230A |
Foreign References:
| WO2017135168A1 | ||||
| US20110235292 |
Attorney, Agent or Firm:
Honda Ichiro
Yumiko Sugimoto
Takumi Watanabe
Takashi Daejeon
Yumiko Sugimoto
Takumi Watanabe
Takashi Daejeon