Title:
THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2014019795
Kind Code:
A
Abstract:
To provide a thermosetting resin composition excellent in low thermal expansion and desmear resistance, and a prepreg, a laminate and a printed wiring board using the same.
A thermosetting resin containing (a) an epoxy resin having a naphthalene skeleton, (b) a silicone compound having amine groups at both ends, (c) an amine compound having an acidic substituent and (d) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure, and a prepreg, a laminate and a printed wiring board using the same are provided.
Inventors:
HASHIMOTO SHINTARO
MIYATAKE MASATO
KOTAKE TOMOHIKO
NAGAI SHUNSUKE
INOUE YASUO
TAKANEZAWA SHIN
MURAI HIKARI
MIYATAKE MASATO
KOTAKE TOMOHIKO
NAGAI SHUNSUKE
INOUE YASUO
TAKANEZAWA SHIN
MURAI HIKARI
Application Number:
JP2012160039A
Publication Date:
February 03, 2014
Filing Date:
July 18, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08G59/50; C08J5/24; H05K1/03
Domestic Patent References:
| JP2010043253A | 2010-02-25 | |||
| JP2011157509A | 2011-08-18 | |||
| JP2010043253A | 2010-02-25 | |||
| JP2011157509A | 2011-08-18 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa