Title:
THERMOSETTING RESIN COMPOSITION, AND PREPREG, LAMINATE AND PRINTED WIRING BOARD USING THE SAME
Document Type and Number:
Japanese Patent JP2014019796
Kind Code:
A
Abstract:
To provide a resin composition excellent in low thermal expansion and desmear resistance, and a prepreg, a laminate and a printed wiring board using the same.
A thermosetting resin containing (a) an epoxy resin having a naphthalene skeleton, (b) a maleimide compound having at least two N-substituted maleimide groups in the molecular structure and a phenoxy group, (c) a silicone compound having a primary amino group, and (d) an amine compound having an acidic substituent, and a prepreg, a laminate and a printed wiring board using the same are provided.
Inventors:
HASHIMOTO SHINTARO
MIYATAKE MASATO
KOTAKE TOMOHIKO
NAGAI SHUNSUKE
INOUE YASUO
TAKANEZAWA SHIN
MURAI HIKARI
MIYATAKE MASATO
KOTAKE TOMOHIKO
NAGAI SHUNSUKE
INOUE YASUO
TAKANEZAWA SHIN
MURAI HIKARI
Application Number:
JP2012160040A
Publication Date:
February 03, 2014
Filing Date:
July 18, 2012
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C08J5/24; C08G59/56; C08K3/00; C08L63/00; H01L23/14; H05K1/03
Domestic Patent References:
| JP2010043253A | 2010-02-25 | |||
| JP2011157509A | 2011-08-18 | |||
| JP2010106150A | 2010-05-13 | |||
| JP2010248473A | 2010-11-04 | |||
| JPS62246933A | 1987-10-28 | |||
| JPS63235329A | 1988-09-30 | |||
| JPH03221526A | 1991-09-30 | |||
| JP2000204246A | 2000-07-25 |
Attorney, Agent or Firm:
Tamotsu Otani
Kenichi Hirasawa
Kenichi Hirasawa
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