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Title:
THERMOSETTING RESIN COMPOSITION, TABLET, PACKAGE FOR LIGHT-EMITTING DIODE, AND METHOD FOR MANUFACTURING THEM
Document Type and Number:
Japanese Patent JP2013224359
Kind Code:
A
Abstract:

To impart high fluidity to a curable resin composition for capable of continuing stable manufacturing without causing any unfilled part or weld in transfer molding using the thermosetting resin composition.

A thermosetting resin composition is obtained by keeping a thermosetting resin composition, which is prepared by pre-kneading a component consisting of a resin and a filler, in a condition of 25±5°C for 120 hours, and subsequently performing post-kneading. In the obtained thermosetting resin composition, a spiral flow length (based on the electric functional material industry standard T901 and measured at a mold temperature 170°C, a transfer pressure 7 Mpa, and a curing rate 120 sec) is ≥15% in terms of an elongation percentage relative to that of a thermosetting resin composition obtained by batch kneading without performing separate pre-kneading and post-kneading.


Inventors:
IBA TOSHIAKI
IWAHARA TAKANAO
Application Number:
JP2012096657A
Publication Date:
October 31, 2013
Filing Date:
April 20, 2012
Export Citation:
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Assignee:
KANEKA CORP
International Classes:
C08J3/20; C08G77/48; C08K3/00; C08L83/07; C08L83/14; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
JP2002097342A2002-04-02