Title:
THERMOSETTING RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2019099755
Kind Code:
A
Abstract:
To provide a thermosetting resin composition having excellent workability, and giving a cured product having all of high heat resistance, high adhesiveness, and low water absorption.SOLUTION: The thermosetting resin composition comprises: (A) 30-75 pts.mass of maleimide compound to 100 pts.mass of total (A)-(C) constituents; (B) an aryl group-containing phenol resin by an amount where the equivalent amount of an aryl group in the aryl group-containing phenol resin of the (B) constituent to 1 equivalent of a maleimide group in a maleimide compound of the (A) constituent is 0.5-1.5; and (C) 5-50 pts.mass of a benzoxazine compound to 100 pts.mass of total (A)-(C) constituents.SELECTED DRAWING: Figure 1
Inventors:
KUSHIHARA NAOYUKI
SUMIDA KAZUMASA
SUMIDA KAZUMASA
Application Number:
JP2017234862A
Publication Date:
June 24, 2019
Filing Date:
December 07, 2017
Export Citation:
Assignee:
SHINETSU CHEMICAL CO
International Classes:
C08G73/00; C08G8/28; C08G14/073; C08G65/40
Domestic Patent References:
| JP2004168894A | 2004-06-17 | |||
| JP2014523953A | 2014-09-18 | |||
| JP2013185056A | 2013-09-19 | |||
| JP2017043767A | 2017-03-02 |
Foreign References:
| WO2017170643A1 | 2017-10-05 | |||
| WO2017104294A1 | 2017-06-22 |
Attorney, Agent or Firm:
Mamoru Ushiki