Title:
THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, ANTENNA DEVICE, ANTENNA MODULE AND COMMUNICATION DEVICE
Document Type and Number:
Japanese Patent JP2023168111
Kind Code:
A
Abstract:
To provide a thermosetting resin composition that can express high relative dielectric constant (high Dk) and low dielectric loss tangent (low Df), and a prepreg, a laminate, a metal-clad laminate, a printed wiring board, an antenna device, an antenna module and a communication device, each including the composition.SOLUTION: A thermosetting resin composition includes (a) a maleimide compound having at least one N-substituted maleimide group, (b) a compound that is represented by the formula (1) and is not reactive with the maleimide group included in the component (a), and (c) at least one high-dielectric-constant inorganic filler selected from the group consisting of titanium-based inorganic fillers and zircon-based inorganic fillers. (Xb1 denotes a single bond or a C1-5 aliphatic hydrocarbon group, Rb1 and Rb2 each denote a C1-10 aliphatic hydrocarbon group, an aromatic hydrocarbon group with 6-18 ring-forming carbon atoms, and a heterocyclic aromatic hydrocarbon group with 5-20 ring-forming atoms, an oxygen atom-containing group, and a group consisting of a combination of them, and m and n each denote an integer of 0-5).SELECTED DRAWING: None
Inventors:
KASUGA KEIICHI
MORITA KOJI
HAYASHI CHIHIRO
MORITA KOJI
HAYASHI CHIHIRO
Application Number:
JP2022079765A
Publication Date:
November 24, 2023
Filing Date:
May 13, 2022
Export Citation:
Assignee:
RESONAC HOLDINGS CORP
International Classes:
C08L79/00; B32B15/08; B32B27/20; C08G73/12; C08J5/24; C08K3/013; C08K3/24; C08K5/01; H01Q13/08; H05K1/03
Attorney, Agent or Firm:
Patent Attorney Corporation Otani Patent Office