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Title:
THERMOSETTING RESIN SOLUTION COMPOSITION
Document Type and Number:
Japanese Patent JPH09279034
Kind Code:
A
Abstract:

To obtain a thermosetting resin solution composition having excellent storage stability by using a polynadimidesiloxane precursor resin prepared by reacting nadic anhydride or the like with an aminoorganoalkoxysilane or the like.

An aminoorganoalkoxysilane (e.g. γ- aminopropylmethyldiethoxysilane) represented by the formula: R1nSi(OR2)4-n[wherein R1 is an aminoalkyl, an N-alkylaminoalkyl, an aminoaryl or the like; R2 is H, an alkyl, an aryl or the like; and n is 1-3] or a hydrolyzate thereof is dissolved in a solvent (e.g. 3-methyl-3-methoxybutanol) having a boiling point of about 100-300°C. Next, an equimolar amount of nadic anhydride or an alkylnadic anhydride is added to the solution under agitation and reacted for about 0.5-2hr at about 5-150°C to obtain a thermosetting resin solution composition containing a polynadimidesiloxane precursor. A coating fluid prepared from this composition is applied to a glass plate, dried by heating, and cured to obtain a color filter.


Inventors:
TANIGUCHI MASAHARU
NIWA KATSUHIRO
GOTO TETSUYA
Application Number:
JP2807097A
Publication Date:
October 28, 1997
Filing Date:
February 12, 1997
Export Citation:
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Assignee:
TORAY INDUSTRIES
International Classes:
G02B5/20; C08F32/00; C08F32/08; C08G77/18; C08G77/22; C08G77/26; C08G77/28; C08L83/02; C08L83/06; G02B1/10; G02B1/14; G02F1/1333; (IPC1-7): C08L83/06; C08G77/18; C08G77/26; G02B1/10; G02B5/20; G02F1/1333