Title:
Thick film element with high thermal conductivity in the coating layer
Document Type and Number:
Japanese Patent JP6315642
Kind Code:
B2
Abstract:
The present invention provides a thick film element having a covering layer with high heat conductivity, which comprises a carrier, a thick film coating deposited on the carrier and a covering layer overlaid on the coating. The thick film coating is heating material, and the mode of heating is electrical heating. The covering layer, the thick film coating and the carrier are selected from a material that fulfills every of the following equations: » 1 A T 1 T 0 d 1 = a × » 3 A T 3 T 0 d 3 , » 2 A T 2 T 0 d 2 = b × » 1 A T 1 T 0 d 1 , » 2 A T 2 T 0 d 2 = c × » 3 A T 3 T 0 d 3 ; wherein 200¤a¤10 4 , 0
Inventors:
Huang Wei Satoshi
Application Number:
JP2017525108A
Publication Date:
April 25, 2018
Filing Date:
March 26, 2016
Export Citation:
Assignee:
Cantonese New Materials Technology Co., Ltd.
International Classes:
H05B3/20; B32B7/02; H05B3/10; H05B3/12
Domestic Patent References:
| JP2007265647A |
Attorney, Agent or Firm:
try international patent corporation