Title:
THIN BLADE GRINDING WHEEL AND DICING METHOD
Document Type and Number:
Japanese Patent JP2010017826
Kind Code:
A
Abstract:
To provide a thin blade grinding wheel superior in grinding, cutting property, durability, and balance between rigidity and toughness.
The thin blade grinding wheel consists of polyimide film containing abrasive grains composed of diamond and/or cubic crystal boron nitride (CBN) with an average particle size of 0.1 m to 10 m within a range from 5 mass% to 50 mass%, and has a thickness of 1 m to 30 m. In the polyimide film, at least a residue of aromatic tetracarboxylic acids is a pyromellitic acid, and a residue of aromatic diamines is a diamine having a benzoxazole structure. The thin blade grinding wheel has a linear expansion coefficient in a planar direction of -10 ppm/C to 20 ppm/C.
Inventors:
OKAMOTO ATSUSHI
OKUYAMA TETSUO
MAEDA SATOSHI
OKUYAMA TETSUO
MAEDA SATOSHI
Application Number:
JP2008182317A
Publication Date:
January 28, 2010
Filing Date:
July 14, 2008
Export Citation:
Assignee:
TOYO BOSEKI
International Classes:
B24D3/00; B24D3/28; B24D5/12; C08J5/18; H01L21/301
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