To provide a thin film multilayer capacitor where productivity is satisfactory and disconnection never occurs by forming electrodes and a dielectric to be flat.

In the thin film multilayer capacitor, a first main electrode 3a of a first electrode 3 and a second sub electrode 4b of the second electrode 4 exist on an insulation board 1 and on the upper surface of the dielectric 2, and a first sub electrode 3b of a first electrode 3 and a second main electrode 4a of the second electrode 4 exist on the upper surface of another dielectric 2. Thus, a conventional step-like side can be omitted from the upper surface of the dielectric 2, so that the dielectric 2 can be formed to be flat. Thus, the dielectric 2 can be formed easily and its productivity is improved. Moreover, it also becomes easy to form the first and second electrodes 3 and 4 on the upper surface of the dielectric 2, and the first and second electrodes 3 and 4 are never disconnected on the upper surface of the dielectric 2.